Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Effects of Temperature, Moisture and Mechanical Driving Forces

Y.-W. Mai, E-H Wong


Ce livre est accessible aux handicaps Voir les informations d'accessibilité
J'achète
152,25 €
Téléchargement | DRM LCP 🛈 DRM Adobe 🛈 ebook sans DRM
Lecture en ligne (streaming)
Ajouter à ma liste d'envies
Gagnez  22,84 €  en recommandant ce livre avec Readzis

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study

Détails
Auteur
Y.-W.  Mai , E-H  Wong
Marque
Woodhead Publishing
Collection
n.c
Parution
2015-05-23
Pages
482 pages
EAN papier
9781845695286
Langue
Anglais
Informations ebook
EAN PDF
9780857099112
Prix
152,25 €
En savoir plus
Nb pages copiables 48
Nb pages imprimables 48
Taille du fichier 25876 Ko
Ce livre est accessible aux handicaps   Informations sur l'accessibilité
Compatibilité

mobile-and-tablet Pour vérifier la compatibilité avec vos appareils,
consultez la page d'aide

Auteur(s) du livre


Defaut-Illustration Y.-W. Mai
Defaut-Illustration E-H Wong
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
Avis clients

Suggestions personnalisées

Restez informé(e) des événements et promotions ebook

Paiements sécurisés

Paiements sécurisés