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Biographie et livres de Jiawei Zhang

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Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has
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Encapsulation Technologies for Electronic Applications

Haleh Ardebili , Jiawei Zhang , Michael G. Pecht

William Andrew

2018-10-23

epub sans DRM

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and...

216,27 €

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