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Wen-Sheng ZHAO is an associate professor with Hangzhou Dianzi University. He obtained Bachelor degree from Harbin Institute of Technology in 2008, and PhD degree from Zhejiang University in 2013. He was a visiting PhD student at National University of Singapore from 2010 to 2013, and a visiting scholar at Georgia Institute of Technology from 2017 to 2018. His current research interests include interconnects design and simulation, carbon nanoelectronics, and multiphysics simulation. He has
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Téléchargez le livre : Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Faxing Che , Tingyu Lin , Hengyun Zhang , Wensheng Zhao

Woodhead Publishing

2019-11-14

epub sans DRM

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including...

217,30 €

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