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Télécharger le livre :  Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration


Xuejun Fan , John Lau


The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on...

Parution : 2025-05-18
Format(s) : PDF, ePub
Éditeur : Springer
J'achète
179,34

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